21 ?general purpose dielectric for ceramic capacitors ?eia class ii dielectric ?temperature variation of capacitance is within ?5% from -55? to +85? ?well suited for decoupling and filtering applications ?available in high capacitance values (up to 100?) x5r dielectric general specifications part number (see page 2 for complete part number explanation) general description % capacitance -60 -40 -20 0 +20 +40 +60 +80 temperature c temperature coefficient 20 15 10 5 0 -5 -10 -15 -20 typical electrical characteristics insulation resistance (ohm-farads) 1,000 10,000 100 0 insulation resistance vs temperature 0 20 120 40 60 80 temperature c 100 1210 size (l" x w") 4 voltage 4 = 4v 6 = 6.3v z = 10v y = 16v 3 = 25v d = 35v 5 = 50v d dielectric d = x5r 107 capacitance code (in pf) 2 sig. digits + number of zeros m capacitance tolerance k = ?0% m = ?0% a failure rate a = n/a t terminations t = plated ni and sn 2 2 packaging 2 = 7" reel 4 = 13" reel 7 = bulk cass. 9 = bulk a special code a = std. note: contact factory for availability of tolerance options for specific part numbers. contact factory for non-specified capacitance values.
22 x5r dielectric specifications and test methods parameter/test x5r specification limits measuring conditions operating temperature range -55? to +85? temperature cycle chamber capacitance within specified tolerance 2.5% for 50v dc rating freq.: 1.0 khz 10% dissipation factor 3.0% for 25v dc rating voltage: 1.0vrms .2v 3.5% for 16v dc rating for cap > 10 ?, 0.5vrms @ 120hz 5.0% for 10v dc rating insulation resistance 100,000m ? or 500m ? - ?, charge device with rated voltage for whichever is less 120 5 secs @ room temp/humidity charge device with 300% of rated voltage for dielectric strength no breakdown or visual defects 1-5 seconds, w/charge and discharge current limited to 50 ma (max) appearance no defects deflection: 2mm capacitance test time: 30 seconds resistance to variation ?2% flexure dissipation meets initial values (as above) stresses factor insulation initial value x 0.3 resistance solderability 95% of each terminal should be covered dip device in eutectic solder at 230 5? with fresh solder for 5.0 0.5 seconds appearance no defects, <25% leaching of either end terminal capacitance variation ?.5% dip device in eutectic solder at 260? for 60 dissipation meets initial values (as above) seconds. store at room temperature for 24 2 resistance to factor hours before measuring electrical properties. solder heat insulation meets initial values (as above) resistance dielectric meets initial values (as above) strength appearance no visual defects step 1: -55? 2 30 3 minutes capacitance variation 7.5% step 2: room temp 3 minutes dissipation meets initial values (as above) step 3: +85? 2 30 3 minutes thermal factor shock insulation meets initial values (as above) step 4: room temp 3 minutes resistance dielectric meets initial values (as above) repeat for 5 cycles and measure after strength 24 2 hours at room temperature appearance no visual defects capacitance variation ?2.5% dissipation initial value x 2.0 (see above) load life factor insulation initial value x 0.3 (see above) resistance dielectric meets initial values (as above) strength appearance no visual defects capacitance variation ?2.5% load dissipation initial value x 2.0 (see above) humidity factor insulation initial value x 0.3 (see above) resistance dielectric meets initial values (as above) strength charge device with 1.5x rated voltage in test chamber set at 85? 2? for 1000 hours (+48, -0). note: contact factory for specific high cv devices that are tested at 1.5x rated voltage. remove from test chamber and stabilize at room temperature for 24 2 hours before measuring. store in a test chamber set at 85? 2?/ 85% 5% relative humidity for 1000 hours (+48, -0) with rated voltage applied. remove from chamber and stabilize at room temperature and humidity for 24 2 hours before measuring. 1mm/sec 90 mm
23 x5r dielectric capacitance range preferred sizes are shaded letter a e g j k m n q x y z max. 0.33 0.71 0.86 0.94 1.02 1.27 1.40 1.78 2.29 2.54 2.79 thickness (0.013) (0.028) (0.034) (0.037) (0.040) (0.050) (0.055) (0.070) (0.090) (0.100) (0.110) paper embossed size 0201 0402 0603 0805 1206 1210 1812 soldering reflow only reflow only reflow only reflow/wave reflow/wave reflow/wave reflow only packaging all paper all paper all paper paper/embossed paper/embossed paper/embossed all embossed (l) length mm 0.60 0.03 1.00 0.10 1.60 0.15 2.01 0.20 3.20 0.20 3.20 0.20 4.50 0.30 (in.) (0.024 0.001) (0.040 0.004) (0.063 0.006) (0.079 0.008) (0.126 0.008) (0.126 0.008) (0.177 0.012) (w) width mm 0.30 0.03 0.50 0.10 0.81 0.15 1.25 0.20 1.60 0.20 2.50 0.20 3.20 0.20 (in.) (0.011 0.001) (0.020 0.004) (0.032 0.006) (0.049 0.008) (0.063 0.008) (0.098 0.008) (0.126 0.008) (t) terminal mm 0.15 0.05 0.25 0.15 0.35 0.15 0.50 0.25 0.50 0.25 0.50 0.25 0.61 0.36 (in.) (0.006 0.002) (0.010 0.006) (0.014 0.006) (0.020 0.010) (0.020 0.010) (0.020 0.010) (0.024 0.014) wvdc 6.3 10 16 25 4 6.3 10 16 25 50 4 6.3 10 16 25 35 50 6.3 10 16 25 35 50 6.3 10 16 25 35 50 4 6.3 10 16 25 35 50 6.3 10 25 50 cap 100 a (pf) 150 a 220 a c 330 a c 470 a c 680 a c 1000 a a c 1500 a c 2200 a a c 3300 a c 4700 a c g 6800 a c g cap 0.010 a c g (?) 0.015 c g g g 0.022 a c c g g g n 0.033 c g g g n 0.047 a c g g g n 0.068 c g g n 0.10 a c c g g n n 0.15 c g n n 0.22 c c g g n n q 0.33 g g n 0.47 c c g n q q x 0.68 g n n 1.0 c c c g g g j n n p* q q x x x 1.5 nn 2.2 c g g j j n n n q q z x z 3.3 nn q q q z 4.7 g g n n n n* q q q z z 10 k n n n q q q q z 22 n qq q z z z z* 47 qz 100 zz* wvdc 6.3 10 16 25 4 6.3 10 16 25 50 4 6.3 10 16 25 35 50 6.3 10 16 25 35 50 6.3 10 16 25 35 50 4 6.3 10 16 25 35 50 6.3 10 25 50 size 0201 0402 0603 0805 1206 1210 1812 = under development l w t t *optional specifications ?contact factory note: contact factory for non-specified capacitance values
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